Persons

• Counter: 121 | Comments : 0

• Counter: 188 | Comments : 0

The mode of ultra-high metal-insulator-semiconductor diode stressed-deformation materials hermetic assembly design, implemented based on the bond silicon membrane with two gold beam-leads under the effect of temperature and an increased atmospheric pressure, has been investigated. The construction is protected by various sealing materials based on lacquers, enamels and compounds. The recommendations on minimization of the stressed-deformation mode of connection of various materials by optimization of the design and technology of the diode have been developed.

• Counter: 367 | Comments : 0

Epitaxial processes on large diameter substrates are characterized by defective formation of the peripheral areas due to plastic deformation. The formation of zones of plastic deformation depends on the distribution of temperature stress and method of heating and laying the substrate in the reactor. The mathematical models for calculating the thermomechanical tension on the substrate by its radius and thickness have been presented. The research of the influence the substrate holder socket design and method of supporting the substrate on its resistance and stiffness has been executed. The influence of gas dynamic characteristics of the technological process on the quality of epitaxial structures has been considered. Presented results the computer modeling gas-dynamic characteristics of the flow in the epitaxial reactor has been executed. Three types of slotted reactor: prismatic, diffuser and with a elongated substrate holder have been researched. Developed the scientific-technical recommendations by design reactor have been. Using the results of the research were developed epitaxial equipment ETM 150. The results of research of epitaxial structures have been presented. The determining factor in the formation of the plastic deformations are tangential tension from the temperature field along the radius of the substrate. For large-diameter substrates it is advantageous to use the substrate holder with flat socket.

• Counter: 1987 | Comments : 0

• Counter: 1414 | Comments : 0

The main principles for simulation of the RFID-cards thermo-strength have been presented. The finite-element modes have been developed, the simulation results have been given and the influence of the constructive and technological factors on the stress-strain state has been investigated. The most significant factors of the identification cards thermo-strength have been determined.

• Counter: 334 | Comments : 0

To ensure the efficiency, durability and reliability of three-dimensional microelectronic modules the engineering calculation of structures, including modeling of the adhesive-bonded joints, the stipulated choice of materials and design solutions, is necessary. The basic tactical and technical requirements for three-dimensional microelectronic modules and the advantages of the application of adhesive materials in the modules designs have been presented. It has been determined that the strength of the structures of three-dimensional microelectronic modules and the performance characteristics of the adhesive-bonded joints depend on many factors. The most important ones are the properties of the adhesive-bonded material, the construction of joints and the operating conditions. The types of loads affecting the modules in the operation process and their effect upon the structures have been considered. It has been shown that the non-uniform loads, such as peeling and bending, are the most dangerous types of loading for adhesive-bonded joints of the modules. It has been determined that when peeling, a high concentration of the edge stresses arises, leading to the destruction of compounds, and when bending, the concentration of normal and tangential stresses along the length of the adhesive-bonded joints is noted. The analysis of the assortment of adhesive materials, applicable for assembly of the modules has been executed. The choice of adhesive materials has been made with taking to account the main design and technological limitations and the requirements for the adhesive-bonded joints. The modeling of the module designs has been performed and the effect of physical, mechanical and thermal properties of the adhesive-bonded joints and the strength of products when subjected to the inertial loads with an acceleration of 100 g and heated to 40 °C has been determined. It has been stated that the stress values depend on the elastic properties of the adhesive-bonded joints, the nature and value of the effect upon them and are determined by mechanical strength and rigidity of the adhesive material. The recommendations on the design of the adhesive-bonded joints of three-dimensional microelectronic modules have been given. The obtained results have shown that the stresses depend on elastic properties of the adhesive-bonded joints, the nature and value of the effect upon them, and are determined by mechanical strength and rigidity of the adhesive material. To reduce the stresses it is necessary to use more rigid construction materials, and the adhesive-bonded materials must be chosen based on the conditions of the microelectronic module operation.

• Counter: 2121 | Comments : 0

The most significant factors of reliability and durability of a microelectronic module are the design and technology of brazed and adhesive bonding, the elastic strength and plastic properties of the materials of silicon crystal, solder and glue joint. The construction to be created is designed to reduce the weight and size characteristics, to increase the reliability and to ensure the efficient heat dissipation. In the work, when simulating the stress-strain state of the microconnections of microelectronic modules, it has been determined that in tin- bismuth solder the stresses in the assembly materials are distributed more evenly and their value is significantly lower than when using SnPb and SnZn solder: in silicon by 5-30%, in copper conductor by 20-90%. It has been determined that under operating conditions and tests at the elevated temperatures, the voltage in the SnBi solder is 1.5 and 2.2 times lower than in the SnPb and SnZn solder, respectively. It has been shown that the epoxy glue cold curing has good adhesion to various structural materials, low labor intensity of the process and high durability. The rational thickness of glue seam 50-200 microns and a copper conductor of 20 microns has been determined. The recommendations on the design of microconnections of microelectronic modules have been given.

• Counter: 1137 | Comments : 0

In the context of increasing the electronic components integration level, growing functionality and packaging density, as well as reducing the electronics weight and size, an integrated approach to engineering calculations of parts and assemblies of modern functionally and technically complex microelectronic products is required. Of particular importance are engineering calculations and structural modeling using computer-aided engineering systems, and also assessment of structural, technological and operational factors’ impact on the products reliability and performance. This work presents an approach to engineering calculations and microelectronic products modeling based on the finite-element method providing a comprehensive account of various factors (material properties, external loading, temperature fields, and other parameters) impact on the stress-strain state, mechanical strength, thermal condition, and other characteristics of products. On the example of parts and assemblies of products of microelectronic technology, the approximation of structures was shown and computer finite-element models were developed to study various structural and technological options of products and the effects on them. Engineering calculations and modeling of parts and assemblies were performed, taking into account the impact of material properties, design parameters and external influences on the products’ characteristics. Scientific and technical recommendations for structure optimization and design and technology solutions ensuring the products resistance to diverse effects were developed. It has been shown that an integrated approach to engineering calculations and microelectronic products modeling based on the finite-element method provides for the determination of optimal solutions taking into account structural, technological, and operational factors and allows the development of products with high tactical, technical and operational characteristics.

• Counter: 1373 | Comments : 0

The general principles of design of the three-dimensional multichip modules have been presented. The modeling of the multichip modules has been performed and the influence of the structural parameters on the strength and on the thermal behavior of the products has been determined. The values of the thermomechanical stresses, heat resistance and temperatures of overheating of the materials have been determined. The efficiency of heat removal in various designs of three-dimensional modules has been established. The methods to provide the intense heat in the constructions of the modules and the high strength product reliability have been developed. The recommendations for designing the multichip modules have been given.

• Counter: 1440 | Comments : 0

The finite-element models have been developed, the modeling results have been presented and the effect of the design-manufacturing factors upon the stress-strain state has been studied. The most significant factors of the micromodules thermal strength have been established.

• Counter: 1025 | Comments : 0