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The approach to highly-integrated electronic component base development based on three-dimensional (3D) multichip microsystems is currently intensely progressing and implementing in such directions as multilevel packaging of packaged microchips, unpackaged microchips and semiconductor structures. The given approach consists in stacking up chip set in 3D multichip modules and has a variety of advantages compared with 2D-constructions due to higher functional density and efficiency of chip placement and mounting. In this work, researches of multichip microsystems on exposure to various action factors are carried out. The significant impact of materials’ physical mechanical properties and structural-and-technological solutions on product strength was shown. It has been established that ensuring the reliability of electronic component base under formation, targeted at reducing the number of failures and damage and increasing resistance to mechanical, temperature and other actions is assured by observing a set of developed scientific and technical recommendations. A criterion of conductor durability evaluation with account for linear hardening of the material and plastic strain in loading cycle has been elaborated. A comprehensive engineering calculation with simulation based on the finite-element method allows considering the totality of structural, technological and operational aspects of the electronic component base development, reducing the number of design errors, and finding rational technical solutions. Simulation provides a search for options for uniform load distribution on product elements and joints, reduction of bending, torsional, temperature and mounting deformations, inertial loads balance, and increase in strength and endurance of materials and joints.

Key words: electronic component base, multichip microsystems, modular three-dimensional integration of chips; finite-element modeling
Published in: MICRO- AND NANOSYSTEM TECHNOLOGY
Bibliography link: Chugunov E. Yu., Timoshenkov S. P., Pogalov A. I. Development and research of multichip microsystems based on modular three-dimensional integration of chips. Proc. Univ. Electronics, 2024, vol. 29, no. 1, pp. 98–107. https://doi.org/ 10.24151/1561-5405-2024-29-1-98-107

Evgeny Yu. Chugunov
National Research University of Electronic Technology (Russia, 124498, Moscow, Zelenograd, Shokin sq., 1)

Sergey P. Timoshenkov
National Research University of Electronic Technology (Russia, 124498, Moscow, Zelenograd, Shokin sq., 1)

Anatoly I. Pogalov
National Research University of Electronic Technology (Russia, 124498, Moscow, Zelenograd, Shokin sq., 1)

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UDK: 621.3.049.76: 621.396.6
Publication type: Scientific article
DOI: 10.24151/1561-5405-2024-29-1-98-107
RISC id: RLFKBJ

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