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In order to create new generation electronic products based on advanced technologies, new design options are required that consider the switching capabilities of elements and components distributed in a limited space. Flexible boards today have no alternative in ensuring maximum switching density, as well as in 3D assembly and mounting of micromodules. In this work, the developed technological processes of assembly and mounting of the functional module with shield against external effects are considered. The simulation was carried out using finite element method for computer aided implementation. The dimensional pattern of strain and stress distribution in functional module was obtained. It was shown that created design makes it possible to reduce mass-dimensional characteristics, increase reliability, and provides effective heat dissipation, electromagnetic shielding and vibration isolation of micromodules. A new method of silicon crystal assembly using stops is proposed. The selection of materials was carried out and the resulting stresses in the connection were studied. The optimal data with minimum stress concentration factors to ensure materials strength and function has been identified, which has allowed increasing connections endurance under the influence of thermomechanical cycling. Based on the developed finite element models of materials, including computational ones, as well as nodes of the functional micromodule and the principles of their use, the analysis of stress-strain state, thermal processes, effectiveness of electromagnetic shielding, methods of protection against vibration and shock, strength and durability calculations was carried out, which has allowed the selection of rational materials, assembly and mounting methods, and elements and connections design.

Key words: functional micromodule, 3D assembly, microconnection materials, thermomechanical strength, stress-strain state, simulation, engineering and technological recommendations, shield against external effects
Published in: Technological processes and routes
Bibliography link: Titov A. Yu., Pogalov A. I., Timoshenkov S. P. Research of engineering and technological specifics of the 3D assembly and mounting of a functional micromodule. Proc. Univ. Electronics, 2024, vol. 29, no. 3, pp. 281–289. https://doi.org/ 10.24151/1561-5405-2024-29-3-281-289

Sergey P. Timoshenkov

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UDK: 621.3.049.77
Publication type: Scientific article
DOI: 10.24151/1561-5405-2024-29-3-281-289
RISC id: ACQCCF

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