Persons

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The main factors determining the requirements for packaging of micromechanical devices and systems (MEMS) have been shown. The methods of processing materials and creating three-dimensional structures, used in the microsystem engineering, have been analyzed in connection with MEMS packaging. Various technological options for vacuum packaging of Microsystems and the tendencies in this field development have been considered.

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The possibility of applying porous silicon in creation of varicaps with high capacitance ratio, satisfying the requirements of microelectronic and macrosystem technology, has been investigated. The capacitor structures using the copper galvanic deposition to porous silicon pores have been presented. The morphological features of the experimental structures have been studied, the specific capacitance of varicaps has been determined. The obtained results demonstrate the prospects of application of varicaps based on porous silicon in integrated electronics.

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The gas damping influence on bandwidth of the pendulum microaccelerometers has been investigated. It has been found that to increase the bandwidth, it is necessary to provide residual pressure of not higher than 1-5ּ10-1 torr inside the packaged device. This condition can be reached by using the developed technology of the glass-to-metal encapsulation.

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The results of investigation and designing of the technological processes of assembling and mounting MEMS components used for manufacturing breadboard samples have been presented.

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The equations for estimation of the true leak rate for the hermiticity testing of microelectronic devices and MEMS have been proposed.

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