Copper-Containing Compositions Based on Alicyclic Polyimide for Microelectronics

Copper-Containing Compositions Based on Alicyclic Polyimide for Microelectronics

Polymer compositions with high electro-physical properties compatible with fillers of various natures, including metal-containing compounds, are required for microelectronics. Preparation of new copper-containing polymer compositions based on polyimides of alicyclic and aromatic structure with copper salts was the purpose of the work. Investigation was carried out using polycondensation methods, studying thermal, chemical, physical and mechanical properties and electrical conductivity of new film composite materials. The conditions for obtaining copper-containing polymer compositions based on alicyclic polyimide and its copolymers with aromatic polyheterocycles by one-stage polycondensation reaction in the presence of catalytic amounts of inorganic compounds and mechanical mixing of the polymer components with copper salts have been optimized. New film composite material with high physical-mechanical and temperature characteristics, increased resistance to aggressive reagents has been obtained. The developed metal-containing polymer compositions can be recommended for use in microelectronics for integrated circuits manufacture.
Valentina D. Kravtsova
A.B. Bekturov Institute of Chemical Science, Almaty, Republic of Kazakhstan
Mayra B. Umerzakova
A.B. Bekturov Institute of Chemical Science, Almaty, Republic of Kazakhstan
Natalia E. Korobova
National Research University of Electronic Technology, Moscow, Russia
Denis V. Vertyanov
National Research University of Electronic Technology, Moscow, Russia
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