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Expanding the possibilities of an electrostatic chuck automated control within the technological process of substrate processing is an urgent task. Despite the successes achieved in the development, production and application of electrostatic chuck in recent years, the current results have had significant limitations. The authors presented a control improvement method of the substrate processing temperature regime by determining the device characteristics: the minimum allowable voltage of the electrostatic chuck dependence on the pressure of helium under the substrate and the helium flow rate from under the substrate dependence on the electrostatic chuck voltage. The dependencies were obtained by the parameters direct measurement method with the measurement setup. The study results have allowed selecting the optimal operating voltage of the electrostatic chuck to ensure a reliable substrate grip, as well as to implement an indirect assessment of the substrate clamping quality in automatic mode.

Key words: electrostatic clamping, electrostatic chuck, ESC, automated control, substrate holder, processing table
Published in: ELECTRONIC ENGINEERING
Bibliography link: Traktirshchikov V. S., Kalugin V. V., Shiryaev M. E., Cherkunov V. I. Study of the electrostatic chuck parameters dependencies. Izv. vuzov. Elektronika = Proc. Univ. Electronics. 2026;31(5):536–543. (In Russ.). DOI: 10.24151/1561-5405-2026-31-5-536-543.AQGVQJ

Viktor S. Traktirshchikov
JSC SPE ESTE, Moscow, Russia; National Research University of Electronic Technology, Moscow, Russia

Viktor V. Kalugin
National Research University of Electronic Technology, Moscow, Russia

Maksim E. Shiryaev
LLC Estika, Moscow, Russia

Viktor I. Cherkunov
JSC SPE ESTE, Moscow, Russia; National Research University of Electronic Technology, Moscow, Russia

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Information about the publication

UDK: 621.319.5
Publication type: Scientific article
DOI: 10.24151/1561-5405-2026-31-5-536-543
RISC id: AQGVQJ

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