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Design Engineer of the Research Laboratory “Advanced Technologies of 3D Microsystems Packaging and Production”, Student, National Research University of Electronic Technology (Russia, 124498, Moscow, Zelenograd, Shokin sq., 1)

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Analysis of the intermetallic phases AlxAuy and AlxСuy impact on the reliability of microwelded joints of integrated circuits

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11.03.2026 Vol. 31, no. 1, 2026 has been published

Dear colleagues!
We are pleased to inform you that latest issue of scientific and technical journal "Proceedings of Universities. Electronics", vol. 31, no. 1, 2026, has been published on February 16, 2026.

25.02.2026 Please be advised

Starting from 2027, according to Notice received by our Editorial Office, the Pleiades Publishing group of companies discontinues the collaboration with our journal.
Articles published in the Journal “Proceedings of Universities. Electronics” will not be included in additional issues of the journals Semiconductors (iss. 13) and Russian Microelectronics (iss. 7) anymore.

26.12.2025 Vol. 30, no. 6, 2025 has been published

Dear colleagues!
We are pleased to inform you that latest issue of scientific and technical journal "Proceedings of Universities. Electronics", vol. 30, no. 6, 2025, has been published on December 09, 2025.

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