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To ensure the efficiency, durability and reliability of three-dimensional microelectronic modules the engineering calculation of structures, including modeling of the adhesive-bonded joints, the stipulated choice of materials and design solutions, is necessary. The basic tactical and technical requirements for three-dimensional microelectronic modules and the advantages of the application of adhesive materials in the modules designs have been presented. It has been determined that the strength of the structures of three-dimensional microelectronic modules and the performance characteristics of the adhesive-bonded joints depend on many factors. The most important ones are the properties of the adhesive-bonded material, the construction of joints and the operating conditions. The types of loads affecting the modules in the operation process and their effect upon the structures have been considered. It has been shown that the non-uniform loads, such as peeling and bending, are the most dangerous types of loading for adhesive-bonded joints of the modules. It has been determined that when peeling, a high concentration of the edge stresses arises, leading to the destruction of compounds, and when bending, the concentration of normal and tangential stresses along the length of the adhesive-bonded joints is noted. The analysis of the assortment of adhesive materials, applicable for assembly of the modules has been executed. The choice of adhesive materials has been made with taking to account the main design and technological limitations and the requirements for the adhesive-bonded joints. The modeling of the module designs has been performed and the effect of physical, mechanical and thermal properties of the adhesive-bonded joints and the strength of products when subjected to the inertial loads with an acceleration of 100 g and heated to 40 °C has been determined. It has been stated that the stress values depend on the elastic properties of the adhesive-bonded joints, the nature and value of the effect upon them and are determined by mechanical strength and rigidity of the adhesive material. The recommendations on the design of the adhesive-bonded joints of three-dimensional microelectronic modules have been given. The obtained results have shown that the stresses depend on elastic properties of the adhesive-bonded joints, the nature and value of the effect upon them, and are determined by mechanical strength and rigidity of the adhesive material. To reduce the stresses it is necessary to use more rigid construction materials, and the adhesive-bonded materials must be chosen based on the conditions of the microelectronic module operation.

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The general principles of design of the three-dimensional multichip modules have been presented. The modeling of the multichip modules has been performed and the influence of the structural parameters on the strength and on the thermal behavior of the products has been determined. The values of the thermomechanical stresses, heat resistance and temperatures of overheating of the materials have been determined. The efficiency of heat removal in various designs of three-dimensional modules has been established. The methods to provide the intense heat in the constructions of the modules and the high strength product reliability have been developed. The recommendations for designing the multichip modules have been given.

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The finite-element models have been developed, the modeling results have been presented and the effect of the design-manufacturing factors upon the stress-strain state has been studied. The most significant factors of the micromodules thermal strength have been established.

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