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The scattering matrix of a multipole switch or the matrix of S-parameters is widely used to describe the electrical circuits in the form of a black box. The application of S -parameters permits to characterize the circuit in any frequency range. However, the standard simulators of electric circuits do not work with S -parameters. In addition, with the increase of the number circuit’s pins and the working frequency range, the complexity of the matrix grows in times. The classical IC package pin’s model based on self-capacitance, inductance and capacitance of the connection between the adjacent terminals, which can be constructed from the existing S -parameters, has been considered in this work. As a result it is impossible to take into account the RF and microwave effects. In this model it is characterized by low accuracy at high frequencies. The method of the classical model optimization, based on the stochastic optimization algorithm with the purpose to achieve higher accuracy of the model, has been presented. The application of this optimization allows a more than 3 times increase of the model accuracy compared with the classical RLC-model.
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At the IC design phase it is required to consider all possible factors to ensure the produced device’s compliance with specified requirements. For instance, it is necessary to select an optimum package and to lower its impact on IC’s final characteristics. Electromagnetic simulation is widely used to calculate electrical parameters of the electric motors, printed circuit boards, and microcircuits. In this work, full-wave three-dimensional finite element method simulation in frequency domain was used to characterize LGA package. S -parameters matrix obtained by modeling was converted to an equivalent RLGC transmission line model to determine the electrical parameters of the package - self-capacitance and inductance of the leads, mutual capacitance of the adjacent leads, - on which the package bandwidth and crosstalk depend. Correctness of the obtained results was confirmed by comparison with the measurements results. It has been found that discrepancy between the results of modeled and measured capacitance was less than 5 %. The inductance modeling results turned out to be less accurate, which, however, is not significant for low and medium frequency applications.
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