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The analysis of the possible mechanisms of the heat transfer as applied to MEMS sensors based on the residual pressure dependence of the gas thermal conductivity on the residual pressure has been carried out. The peculiarities of the transport phenomena in relation to the thermal Microsystems have been shown. The experimental dependence of the heat losses to the gas on the residual pressure for different sizes of sensors has been presented.
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The disadvantages of the known thermal sensors have been considered. The design of the thermal displacement transducer has been proposed. The preliminary metrological performance has been presented.
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