Persons

A design and size of the membrane module package have a significant impact on its characteristics. It is necessary to use the finite element modeling calculation of the frequency response of the membrane module membrane due to complexity of the package design. In this study the method of the thin dielectric membrane modeling by means of the structural and acoustic analysis in the ANSYS software has been proposed. This method permits to perform the calculation taking into account the influence of the front and back chambers sizes. The dependences of resonance frequency of the front chamber and back chamber on its geometric sizes have been obtained. It has been shown that with the back chamber size increasing, the value of the membrane sensitivity approaches to its parameters in the open space and with the account of the front and back chambers. The membrane modules frequency response comparison has been performed and has been shown that the presence of the front and back chambers significantly affects the values of the resonance frequency and sensitivity. The method of setting resilient stresses in the membrane using thermal impact has been used. The complicatedly deformed state of the membrane, called the buckling effect, has been obtained. The calculation of the dielectric membrane with an account of the buckling effect has been executed. The analysis of the obtained results has been performed and it has been shown that the calculated sensitivity of the membrane with an account of the buckling effect have a good coincidence with the measurements results. The proposed method enables to calculate the membrane module frequency response with an account of impact of the package design peculiarities and also, to take into account the residual stresses in the membrane. The use of the structural-acoustic analysis enables to achieve more accurate results while calculating the membrane frequency response, which increases the efficiency of the acoustic pressure transducers designing, and ensures an achievement of the product optimal characteristics.

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The breadboard model of a mechatronic device microsystem with the magnetotransistor transducers has been experimentally investigated. It has been determined that the microsystem of a mechatronic device with a silicon console, a micromagnet and a magnetotransistor transducer permits to control the micromovings by change of the magnetic field at resonant frequencies of the console with a micromagnet. The proposed microsystem allows receiving a magnetic signal of micromovings and vibration in the mechatronic systems and can be realized in the integrated performance.

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