Publication of the journal

The section is currently being updated

The reliability of the electronic apparatuses operation significantly decreases under such mechanical effects as vibrations, impacts, speed overloads and acoustic noises. The problem of the efficient vibration protection of electronic apparatuses is closely related with such constructing problems, as an arrangement of printed boards, the thermal regime provision, screening, etc. Therefore, the determination of correlation of the printed board structures with their vibration characteristics presents practical interest. The influence of the density installation of lightweight electronic SMD components on the vibration characteristics of multilayer printed circuit boards has been experimentally and theoretically studied. A theoretical model for the qualitative interpretation of measurements has been proposed. It has been shown that the change in the oscillatory characteristics had been determined not by the total mass of the SMD components, but by a change in the structure of the surface mounting and the elastic properties of the printed circuit boards, which must be taken into account when providing the electronic equipment vibration protection. The performed studies confirm that that the surface mounting of the SMD components and an appropriate metallization system make the construction of the printed circuit boards more rigid and this results in the increase of the good quality of natural vibrations.

124498, Moscow, Zelenograd, Bld. 1, Shokin Square, MIET, editorial office of the Journal "Proceedings of Universities. Electronics", room 7231

+7 (499) 734-62-05
magazine@miee.ru