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Articles

  • The constructive and technological schemes of self-formation of completely self-combined vertically integrated transistor structures for ULIC have been presented. The exact positioning of the elements with nanometer sizes on a surface and at a certai...

Authors: Vitaliy D. Verner, Nikolay M. Lukanov, Alexander N. Saurov
23 - 30
  • The method for fabrication of HEMTs, in which T-gate is formed using the nanoimprint lithography technology, has been presented. The characteristics of the created GaAs pHEMT transistors have been investigated. The developed transistor has the gate b...

Authors: Vladimir I. Egorkin, Alexey A. Zaitsev , Sergey S. Shmelev
31 - 37
  • The models of electro-physical effects built-into Sentaurus TCAD have been tested. The models providing an adequate modeling of deep submicron high-k MOSFETs have been selected. The gate and drain leakage currents for 45 nm MOSFET with PolySi gate an...

Authors: Dmitriy A. Popov, Lev M. Sambursky, Igor A. Kharitonov
38 - 43

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