1. CHP, HCHP high stability resistor chips. Vishay. Available at: https://www.vishay.com/docs/52023/chp.pdf (accessed: 10.03.2025).
2. Andersson M. Equivalent circuit models for discrete passive components. In: CARTS Europe 2008 (Helsinki, Finland, Oct. 20–23, 2008). Alpharetta, GA: ECIA; 2008, pp. 85–93.
3. Advanced Design System (ADS). Keysight. Available at: https://www.keysight.com/us/en/products/software/pathwave-design-software/pathwave-advanced-design-s... (accessed: 01.03.2025).
4. AWR Design Environment platform. Cadence. Available at: https://www.cadence.com/en_US/home/tools/system-analysis/rf-microwave-design/awr-design-environment-... (accessed: 01.03.2025).
5. САПР Delta Design. ЭРЕМЕКС. Available at: https://www.eremex.ru/products/delta-design/ (accessed: 11.03.2026).
Delta Design CAD. EREMEX. (In Russ.). Available at: https://www.eremex.ru/products/delta-design/ (accessed: 11.03.2026).
6. Naishadharn K. Experimental equivalent-circuit modeling of SMD inductors for printed circuit applications. IEEE Trans. Electromagn. Compat. 2001;43(4):557–565. https://doi.org/10.1109/15.974635
7. Naishadham K., Durak T. Measurement-based closed-form modeling of surface-mounted RF components. IEEE Trans. Microwave Theory Tech. 2002;50(10):2276–2286. https://doi.org/10.1109/TMTT.2002.803431
8. Andersson J., Fahd M. High frequency modeling of SMD resistors. Chalmers ODR. 2024. Available at: https://odr.chalmers.se/items/81b9a294-7079-4cca-bef4-9e2f8759393f (accessed: 11.03.2026).
9. Understanding chip capacitors. Johanson Dielectrics. Available at: https://www.johansondielectrics.com/tech-notes/understanding-chip-capacitors/ (accessed: 11.03.2026).
10. Mišlov R., Mageri M., Fratte-Sumper S., Weiss B., Stockreiter Ch., Barić A. Modelling SMD capacitors by measurements. In: 2016 39th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO). Opatija: IEEE; 2016, pp. 104–109. https://doi.org/10.1109/MIPRO.2016.7522120
11. Seong-Sik Song, Seung-Wook Lee, Gil J., Shin H. Simple wide-band metal-insulator-metal (MIM) capacitor model for RF applications and effect of substrate grounded shields. Jpn. J. Appl. Phys. 2004;43(4S):1746–1751. https://doi.org/10.1143/JJAP.43.1746
12. FC high frequency (up to 40 GHz) resistor. Vishay. Available at: https://www.vishay.com/docs/60093/fcseries.pdf (accessed: 03.03.2025).
13. Gildenblat G. (ed.) Compact modeling: Principles, techniques and applications. Dordrecht: Springer; 2010. 544 p.
14. Murji R., Deen M. J. A scalable meander-line resistor model for silicon RFICs. IEEE Trans. Electron Devices. 2002;49(1):187–190. https://doi.org/10.1109/16.974769
15. SPICE model – 0603CT. Coilcraft. Available at: https://www.coilcraft.com/getmedia/581dc73a-0258-4e9d-b645-10261f5e586f/spice_0603ct.pdf (accessed: 03.03.2025).
16. RF inductors (coils). Murata. Available at: https://www.murata.com/en-global/tool/data/spicedata/netlist-inductor (accessed: 11.03.2026).
17. Multilayer ceramic chip capacitors. TDK Corporation. Available at: https://product.tdk.com/en/search/capacitor/ceramic/mlcc/info?part_no=C1608X7R2A222K080AA (accessed: 03.03.2025).
18. Multilayer ceramic capacitors. Murata. Available at: https://www.murata.com/en-global/tool/data/spicedata/netlist-mlcc (accessed: 11.03.2026).
19. Chen J., Li X.-M., Wu R.-X. Equivalent circuit model of lumped elements retrieved from measured S-parameters of microstrip line in frequency range 0.5–5GHz. In: 2020 IEEE MTT-S International Wireless Symposium (IWS). Shanghai: IEEE; 2020, pp. 1–3. https://doi.org/10.1109/IWS49314.2020.9360005
20. Beley M., Pace L., Bréard A. An accurate characterization method of passive components for Very High Frequency power conversion applications. In: 2024 Energy Conversion Congress & Expo Europe (ECCE Europe). Darmstadt: IEEE; 2024, pp. 1–8. https://doi.org/10.1109/ECCEEurope62508.2024.10751881
21. Bačmaga J., Štimac H., Barić A. Combined series and shunt characterization for accurate resonant frequency extraction and circuit modelling of surface-mount inductors. In: 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI). Cologne: IEEE; 2020, pp. 1–4. https://doi.org/10.1109/SPI48784.2020.9218212
22. Bahl I. J. Lumped elements for RF and microwave circuits. 2nd ed. Boston; London: Artech House; 2022. 600 p.
23. Белков И., Еремеев Ю., Малышев И., Рыбкин С. Разработка моделей отечественных пассивных электронных компонентов и их интеграция в системы автоматизированного проектирования. Электроника: НТБ. 2021;(3):80–87. https://doi.org/10.22184/1992-4178.2021.204.3.80.86. EDN: DRKEJU.
Belkov I., Eremeev Yu., Malyshev I., Rybkin S. Development of domestic passive electronic components models and their integration into computer-aided design systems. Elektronika: NTB = Electronics: STB. 2021;(3):80–87. (In Russ.). https://doi.org/10.22184/1992-4178.2021.204.3.80.86
24. Лупанова Е. А., Никулин С. М. Измерение волнового сопротивления микрополосковой линии. In: Информационные системы и технологии ИСТ-2022: сб. материалов XXVIII Междунар. науч.-техн. конф. (Нижний Новгород, 23–24 апр. 2022 г.). Н. Новгород: НГТУ им. Р. Е. Алексеева; 2022, с. 124–129. EDN: FXXFYM.
Lupanova E. A., Nikulin S. M. Measurement of the wave resistance of a microstrip line. In: Informatsionnyye sistemy i tekhnologii IST-2022: proceedings of 28th International sci.-tech. conf. (Nizhny Novgorod, Apr. 23–24, 2022). Nizhny Novgorod: NNSTU n. a. R. E. Alekseev; 2022, pp. 124–129. (In Russ.).
25. Малышев И. Н., Белков И. Г., Колдина Е. А., Лупанова Е. А., Никулин С. М. Измерение собственных параметров SMD-компонентов в экранированной копланарной линии передачи. Электроника и микроэлектроника СВЧ. 2023;1:49–53. EDN: AEJWOB.
Malyshev I. N., Belkov I. G., Koldina E. A., Lupanova E. A., Nikulin S. M. Measurement of inherent parameters of SMD components in a shielded coplanar transmission line. Elektronika i mikroelektronika SVCh. 2023;1:49–53. (In Russ.).
26. Muyshondt G. P., Portnoy W. M. Development of high frequency SPICE models for ferrite core inductors and transformers. In: Conference Record of the IEEE Industry Applications Society Annual Meeting. San Diego, CA: IEEE; 1989, vol. 2, pp. 1328–1333. https://doi.org/10.1109/IAS.1989.96815
27. Choi D.-K., Jeon H.-P., Na E.-S., Sang Woo Kim. Non-linear behavior of multilayer ceramic capacitors with a new equivalent circuit under AC-fields. J. Ceram. Process. Res. 2007;8(4):229–232. https://doi.org/10.36410/jcpr.2007.8.4.229
28. Nazoa N. S-parameter measurement of SMT components using the LA19-13-03 VNA. NANOPDF. Nov. 2013. Available at: https://nanopdf.com/download/s-parameter-measurement-of-smt-device_pdf (accessed: 11.03.2026).
29. Davis W. A., Agarwal K. Radio frequency circuit design. 2nd ed. Hoboken, NJ: Wiley – IEEE; 2010. 424 p.
30. LTspice. Analog Devices. Available at: https://www.analog.com/en/resources/design-tools-and-calculators/ltspice-simulator.html (accessed: 03.03.2025).
31. PCB design software | OrCAD X. Cadence. Available at: https://www.cadence.com/en_US/home/tools/pcb-design-and-analysis/orcad.html (accessed: 03.03.2025).