A new class of quasireflectionless potentials, associated with low energy scattering, has been considered. The effective parameters of low energy scattering have been determined using the system expansion by the wave vectors in the region of the parameters corresponding to the exit of the localized states into the continuum. The parameters of the heterostructures, formed by the composition step-like distribution, which provide the reflectionless conditions in the low-energy region, have been found.
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The GaN based devices with respect to most parameters exceed the devices based on traditional semiconductor materials. The AlGaN-transistors are the devices, operating in the depletion mode. For most applications it is necessary to implement the operating mode E , when the current in the channel is closed at zero gate voltage. In this paper the novel method namely using the p -GaN layer under the gate has been considered. The plasma-chemical removal of p -GaN layer in the non-gated active region has been chosen as a formation method of this layer. In this case the challenges, namely the non-uniformity in the depth of etching and poor control of the etching rate, arise. To exclude these problems, the heterostructures with additional AlN barrier layer has been developed. The research results of the heterostructure parameters affecting the carrier concentration in the channel, and, respectively, the transistor output characteristics have been presented and the developed design process has been shown. According to it the normally-off transistors have been formed. The maximum drain current in the open state is 350 mA/mm at 4 V gate voltage and the breakdown voltage is about 550 V in closed state at 0 V gate voltage.
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