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Senior Engineer, Central Research Institute of Chemistry and Mechanics (Russia, 115487, Moscow, Nagatinskaya st., 16A)

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Study on the role of hydrostatic effects in molten Sn layer in the formation of a vacuum-tight SLID coupling of Cu-Sn

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The MEMS wafer-level sealing technology based on SLID structures grown from Cu-Sn organometallic complexes electrolytes

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27.04.2026 Vol. 31, no. 2, 2026 has been published

Dear colleagues!
We are pleased to inform you that latest issue of scientific and technical journal "Proceedings of Universities. Electronics", vol. 31, no. 2, 2026, has been published on April 15, 2026.

11.03.2026 Vol. 31, no. 1, 2026 has been published

Dear colleagues!
We are pleased to inform you that latest issue of scientific and technical journal "Proceedings of Universities. Electronics", vol. 31, no. 1, 2026, has been published on February 16, 2026.

25.02.2026 Please be advised

Starting from 2027, according to Notice received by our Editorial Office, the Pleiades Publishing group of companies discontinues the collaboration with our journal.
Articles published in the Journal “Proceedings of Universities. Electronics” will not be included in additional issues of the journals Semiconductors (iss. 13) and Russian Microelectronics (iss. 7) anymore.

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