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Manufacturers of plastic packages use high silica filler epoxy molding compounds to reduce the difference in coefficient of thermal expansion between the die and the encapsulation material. However, in addition to the die, commutation substrate has a significant effect on the thermo-mechanical stresses level in the package. Three-dimensional integration makes it possible to combine several substrates, which can be made from various dielectrics, in a one microassembly with the help of a vertical volume commutation. This work shows that the use of capsulation materials with different thermal expansion coefficient in the outer and inner parts of the product can reduce the level of temperature stresses in such a structure. The dependences of the thermo-mechanical stress and deformation on the number of levels and the amount of filler in the external compound were established. This study was carried out by means of computer simulation for various designs of microassemblies capsulated with compounds characterized by different values of temperature and mechanical parameters. The dependences obtained in the article allow us to establish optimal values of filler content in the external and internal compounds to ensure minimal thermal and mechanical (under the influence of acceleration) deformation of microassemblies with different levels.

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