Persons

Svetlana I. Gladkova

National Research University of Electronic Technology, Moscow, Russia
Design Engineer of the Research Laboratory “Advanced Technologies of 3D Microsystems Packaging and Production”, Student, National Research University of Electronic Technology (Russia, 124498, Moscow, Zelenograd, Shokin sq., 1)

Vadim A. Rabtsevich

National Research University of Electronic Technology, Moscow, Russia
Design Engineer of the Research Laboratory “Advanced Technologies of 3D Microsystems Packaging and Production”, Student, National Research University of Electronic Technology (Russia, 124498, Moscow, Zelenograd, Shokin sq., 1)

Vladimir I. Konchenkov

Volgograd State Technical University (Russia, 400005, Volgograd, Lenin Ave, 28); Volgograd State Socio-Pedagogical University (Russia, 400005, Volgograd, Lenin Ave, 27)
Cand. Sci. (Phys.-Math.), Assoc. Prof. of the Computer Science and Technology Department, Volgograd State Technical University (Russia, 400005, Volgograd, Lenin Ave, 28); Assoc. Prof. of the Higher Mathematics and Physics Department, Volgograd State Socio-Pedagogical University (Russia, 400005, Volgograd, Lenin Ave, 27)

Anna Yu. Korovina

JSC NIIMA Progress, Moscow, Russia
Project Manager, JSC NIIMA Progress (Russia, 124498, Moscow, Cherepanov dr., 54)

Denis I. Artyushin

JSC NIIMA Progress, Moscow, Russia
Chief Technologist, JSC NIIMA Progress (Russia, 124498, Moscow, Cherepanov dr., 54)
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