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Microstrip attenuators are constructed using suspended absorbing elements (AE) based on distributed resistive structures that differ from AE with discrete film resistors manufactured according to P- or T-circuits in that they have increased broadband, low sensitivity to point defects and inhomogeneities, variation of technological parameters, greater reliability, and resistance to temperature influence. In this work, the simulation of microstrip attenuators for the attenuation range of 3-35 dB with suspended AE with dimensions of 2 × 2 × 0.5 mm and 1 × 1 × 0.25 mm based on distributed resistive structures is carried out. The influence of methods of AE mounting into the substrate of a microstrip line (with a resistive film down, up, into the hole), of conditions of its grounding determined by the number and diameter of the grounding elements, of thickness and dielectric constant of the AE substrate material, of its reverse side metallization area, as well as of contact geometry, of the resistive film topology and of attenuation magnitude on the attenuators’ frequency characteristics ( S 11, S 12 and voltage standing wave ratio) was investigated. The simulation results in the CST Studio Suite and Ansys HFSS software presented in the form of graphs have been analyzed and can be used to optimize the designs of microstrip attenuators, as well as of other devices with suspended elements in the considered mounting methods.
Anton V. Pilkevich
Nizhny Novgorod State Technical University nаmed after R. E. Alekseev (Russia, 603950, Nizhny Novgorod, Minin st., 24)
Viktor D. Sadkov
Nizhny Novgorod State Technical University nаmed after R. E. Alekseev (Russia, 603950, Nizhny Novgorod, Minin st., 24)

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