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Radiation hardness assurance for microelectronics in general is mandatory for every wafer lot. Core manufacturing process should be controllable to ensure accuracy and stability of all stated parameters of the given product including its radiation hardness. Monitoring and statistical regulation method for core manufacturing process is developed based on data acquired from either radiation-oriented characterization of this process or preliminary tests during product development. On each fabrication step the corresponding test structures are used for predictive estimation of the product’s radiation hardness. In this work, based on both engineering and periodical data a set of test structures suitable for core manufacturing process control is proposed, using the example of the 250 nm CMOS SOI technology and fulfilling radiation hardness requirements. Statistical processing of the monitoring data for wafer lots is oriented to verify the degree of current lot deviation from basic lot chosen as standard for comparison. However, because lot size is small (3 pcs) it has been proposed to evaluate lot homogeneity with nonparametric statistical criteria. The considered approach makes it possible to guarantee required radiation hardness through core manufacturing process controllability and stability which allows for less economic value and tests volume minimization.
Julia M. Moskovskaya
National Research Nuclear University “MEPhI” (Moscow Engineering Physics Institute), Russia, 115409, Moscow, Kashirskoe ave., 31; “ENPO SPELS” JSC, Russia, 124498, Moscow, Zelenograd, Shokin sq., 1; SMC “Technological Centre”, Russia, 124498, Moscow, Zele
Dmitry V. Boychenko
National Research Nuclear University “MEPhI” (Moscow Engineering Physics Institute), Russia, 115409, Moscow, Kashirskoe ave., 31; “ENPO SPELS” JSC, Russia, 124498, Moscow, Zelenograd, Shokin sq., 1

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