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Self-heating effects and heat sink problems in lateral power SOI-MOSFET's have been studied. Using the process and device simulation TCAD tools the output characteristics and safe operation area have been simulated. It has been shown that the safe operation area limitations to higher extent are related with the structure self-heating than with the parasitic bipolar transistor turning on.
Yury A. Chaplygin
National Research University of Electronic Technology, Moscow, Russia

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